Backside Hot Spot Detection Using Liquid Crystal Microscopy. - Olivier Crépel; Felix Beaudoin; Lionel Dantas de Morais; Gérald Haller; C. Goupil; Philippe Perdu; Romain Desplats; Dean Lewis (Microelectron. Reliab., 2002)

Magnetic field measurements for Non Destructive Failure Analysis. - Olivier Crépel; C. Goupil; Bernadette Domengès; Philippe Descamps; Philippe Perdu; A. Doukkali (Microelectron. Reliab., 2002)

Magnetic emission mapping for passive integrated components characterisation. - Olivier Crépel; Romain Desplats; Y. Bouttement; Philippe Perdu; C. Goupil; Philippe Descamps; Felix Beaudoin; L. Marina (Microelectron. Reliab., 2003)

Magnetic Microscopy for IC Failure Analysis: Comparative Case Studies using SQUID, GMR and MTJ systems. - Olivier Crépel; Patrick Poirier; Philippe Descamps; Romain Desplats; Philippe Perdu; Gérald Haller; Abdellatif Firiti (Microelectron. Reliab., 2004)

Failure Analysis enhancement by evaluating the Photoelectric Laser Stimulation impact on mixed-mode ICs. - Magdalena Sienkiewicz; Philippe Perdu; Abdellatif Firiti; Kevin Sanchez; Olivier Crépel; Dean Lewis (Microelectron. Reliab., 2008)

Test methodology of a new upset mechanism induced by protons in deep sub-micron devices. - Cécile Weulersse; Florent Miller; Dan Alexandrescu; Erwin Schaefer; Olivier Crépel; Rémi Gaillard (Microelectron. Reliab., 2012)

Using the EM simulation tools to predict the Conducted Emissions level of a DC/DC boost converter: Introducing EBEM-CE model. - André Durier; Christian Marot; Olivier Crépel (EMC Compo, 2013)

Radiation robustness of normally-off GaN/HEMT power transistors (COTS). - Moustafa Zerarka; Olivier Crépel (Microelectron. Reliab., 2018)

Investigation of the Impact of Neutron Irradiation on SiC Power MOSFETs lifetime by Reliability Tests. - Fabio Principato; Giuseppe Allegra; Corrado Cappello; Olivier Crépel; Nicola Nicosia; Salvatore D'Arrigo; Vincenzo Cantarella; Alessandro Di Mauro; Leonardo Abbene; Marcello Mirabello; Francesco Pintacuda (Sensors, 2021)