Reliability of lead-free solder in power module with stochastic uncertainty. - Alexandre Micol; Carmen Martin; Olivier Dalverny; Michel Mermet-Guyennet; Moussa Karama (Microelectron. Reliab., 2009)

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. - Alexandre Micol; A. Zeanh; T. Lhommeau; Stephane Azzopardi; Eric Woirgard; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2009)

Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications. - Sabeur Msolli; Joël Alexis; Olivier Dalverny; Moussa Karama (Microelectron. Reliab., 2015)

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. - J. B. Libot; Joël Alexis; Olivier Dalverny; L. Arnaud; P. Milesi; F. Dulondel (Microelectron. Reliab., 2018)

Post-earthquake Damage Assessment: Feedback from a Cross-Border Crisis Exercise. - Samuel Auclair; Christian Iasio; Andreï Balgiu; Antoni Blasquez; Jean-Christophe Castagnos; Emilie Crochet; Olivier Dalverny; Xavier Goula; Paco Martinez; Philippe Méresse; Philippe Soulé-Péré; Ghislaine Verrhiest-Leblanc (ISCRAM, 2022)