Impact of low-frequency substrate disturbances on a 4.5GHz VCO. - Françis Calmon; Cristian Andrei; Olivier Valorge; José-Cruz Nuñez Pérez; Jacques Verdier; Christian Gontrand (Microelectron. J., 2006)

A Simple Way for Substrate Noise Modeling in Mixed-Signal ICs. - Olivier Valorge; Cristian Andrei; Françis Calmon; Jacques Verdier; Christian Gontrand; Pierre Dautriche (IEEE Trans. Circuits Syst. I Regul. Pap., 2006)

Signal Integrity Analysis of a High Precision D/A Converter. - Olivier Valorge; David Marche; Alain Lacourse; Mohamad Sawan; Yvon Savaria (ICECS, 2007)

Electromagnetic Compatibility Modeling in Low-Noise Medical Sensor Interfaces. - Olivier Valorge; Benoit Gosselin; Louis-François Tanguay; Mohamad Sawan (ISCAS, 2007)

Digital signal propagation on a wafer-scale smart active programmable interconnect. - Olivier Valorge; Anh Tuan Nguyen; Yves Blaquière; Richard Norman; Yvon Savaria (ICECS, 2008)

A spatially reconfigurable fast differential interface for a wafer scale configurable platform. - Olivier Valorge; Yves Blaquière; Yvon Savaria (ICECS, 2010)

Modelling of through silicon via and devices electromagnetic coupling. - Mohamed Abouelatta-Ebrahim; Rabah Dahmani; Olivier Valorge; Françis Calmon; Christian Gontrand (Microelectron. J., 2011)

Configurable Input-Output Power Pad for Wafer-Scale Microelectronic Systems. - Nicolas Laflamme-Mayer; Walder Andre; Olivier Valorge; Yves Blaquière; Mohamad Sawan (IEEE Trans. Very Large Scale Integr. Syst., 2013)

Experimental and simulation results on Si integrated inductor efficiency for smart RF-ICs. - A. S. Royet; J. C. Barbe; Olivier Valorge; L. Remy; I. Constant (ICECS, 2014)

Corrigendum to "Modelling of through silicon via and devices electromagnetic coupling" [Microelectron. J 42 (2011) 316-324]. - Mohamed Abouelatta-Ebrahim; Rabah Dahmani; Olivier Valorge; Françis Calmon; Christian Gontrand (Microelectron. J., 2015)

An efficient and simple compact modeling approach for 3-D interconnects with IC's stack global electrical context consideration. - Jean-Etienne Lorival; Françis Calmon; Fengyuan Sun; Felipe Frantz; Carole Plossu; Martine Le Berre; Ian O'Connor; Olivier Valorge; Jean Charbonnier; David Henry; Christian Gontrand (Microelectron. J., 2015)

A novel spatially configurable differential interface for an electronic system prototyping platform. - Wasim Hussain; Olivier Valorge; Yves Blaquière; Yvon Savaria (Integr., 2016)

Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies. - Mohammad Alsukour; Olivier Valorge; Margot Faure; Loïc Vincent; Victor Milon; Pascal Chevalier 002; Emmanuel Pistono; Jean-Daniel Arnould; Christophe Dubarry (3DIC, 2024)

Hybrid Integration of 3D-RF Interconnects on AlGaN/GaN/Si HEMT RF Transistor featuring 2.2W/mm Psat & 41% PAE @28GHz using a Robust and Cost-Effective Chiplet Heterogeneous Bonding Technique. - A. Divay; Olivier Valorge; Christophe Dubarry; M. Medbouhi; Rémi Franiatte; Daniel Mermin; R. Velard; Y. Gobil; F. Morisot; Erwan Morvan; Ismael Charlet; Luca Lucci; et al. (VLSI Technology and Circuits, 2024)