Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules. - Risto Rautioaho; Olli Nousiainen; Seppo Leppävuori; Jaakko Lenkkeri; Tuomo Jaakola (Microelectron. Reliab., 2001)

Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies. - T. Kangasvieri; Olli Nousiainen; Jussi Putaala; Risto Rautioaho; J. Vähäkangas (Microelectron. Reliab., 2006)

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies. - Olli Nousiainen; L. Lehtiniemi; T. Kangasvieri; Risto Rautioaho; J. Vähäkangas (Microelectron. Reliab., 2008)

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors. - Jussi Putaala; Jari Hannu; Esa Kunnari; Matti Mäntysalo; Olli Nousiainen; Heli Jantunen (Microelectron. Reliab., 2014)