Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. - Kumail Khurram; Asisa Kumar Panigrahi; Satish Bonam; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC. - C. Hemanth Kumar; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. - Suraj Patil; Asisa Kumar Panigrahi; Satish Bonam; C. Hemanth Kumar; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC. - Suraj Singh; Asisa Kumar Panigrahi; Om Krishan Singh; Shiv Govind Singh (3DIC, 2016)

Performance analysis of machine learning classifier on different cow health datasets. - Ranjita Chakraborty; Aparna Pramanik; Sabyasachi Majumdar; Devdulal Ghosh; Soumik Layek; Hena Ray; Alokesh Ghosh; Om Krishan Singh; Tarun Kanti Ghosh (ICST, 2023)