A 3D heterogeneous integration method using LTCC wafer for RF applications. - Xiaoyu Mi; Osamu Toyoda; Satoshi Ueda; Fumihiko Nakazawa (3DIC, 2011)

Effect of frequency in the 3D integration of a PZT-actuated MEMS switch using a single crystal silicon asymmetric beam. - Fumihiko Nakazawa; Takeaki Shimanouchi; Tadashi Nakatani; Takashi Katsuki; Hisao Okuda; Osamu Toyoda; Satoshi Ueda (3DIC, 2011)

A wireless motor-condition, precise analysis system using a highly efficient vibration-energy harvester. - Takeaki Shimanouchi; Osamu Toyoda; Fumihiko Nakazawa (INDIN, 2013)