Bottom-up methodology for predictive simulations of self-heating in aggressively scaled process technologies. - D. Singh; Oscar D. Restrepo; P. P. Manik; N. Rao Mavilla; H. Zhang; Peter C. Paliwoda; S. Pinkett; Y. Deng; Eduardo Cruz Silva; Jeffrey B. Johnson; M. Bajaj; S. Furkay; et al. (IRPS, 2018)

Thermal Characterization and TCAD Modeling of a Power Amplifier in 45RFSOI for 5G mmWave Applications. - Peter C. Paliwoda; Mohamed A. Rabie; Oscar D. Restrepo; Eduardo Cruz Silva; E. Kaltalioglu; Fernando Guarin; Kenneth Barnett; Jeffrey B. Johnson; William Taylor; Myra Boenke; Byoung Min (IRPS, 2020)

RF long term aging behavior and reliability in 22FDX WiFi Power Amplifier designs for 5G applications. - P. Srinivasan 002; J. Lestage; Shafi Syed; X. Hui; Stephen Moss; Oscar D. Restrepo; Oscar H. Gonzalez; Y. Chen; T. McKay; Anirban Bandyopadhyay; Ned Cahoon; Fernando Guarin; et al. (IRPS, 2023)

EDA method to address interconnect reliability and reduce overdesign in custom analog designs. - Markus Herklotz; I. Kühn; Oscar D. Restrepo; S. Siemes; S. Choi; H. Mau (IRPS, 2024)

Thermal Considerations on RF Reliability and Aging in SOI CMOS Based Power Amplifiers. - P. Srinivasan 002; Oscar H. Gonzalez; Oscar D. Restrepo; J. Lestage; Shafi Syed; W. Taylor; Anirban Bandyopadhyay; Martin Gall; S. Ludvik (IRPS, 2024)

A New Methodology to Evaluate Die-Package Level Load-Pull and Ruggedness for RF Long Term Aging for 5G Applications. - P. Srinivasan 002; Oscar H. Gonzalez; J. Lestage; Stephen Moss; Oscar D. Restrepo; S. Ludvik (IRPS, 2025)