Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. - Y. S. Zheng; Q. Guo; Y. J. Su; P. D. Foo (Microelectron. J., 2003)

Investigation of defect on copper bond pad surface in copper/low k process integration. - Y. S. Zheng; Y. J. Su; B. Yu; P. D. Foo (Microelectron. Reliab., 2003)