Intermediate wafer level bonding and interface behavior. - C. T. Pan; P. J. Cheng; M. F. Chen; C. K. Yen (Microelectron. Reliab., 2005)

Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet. - C. T. Pan; P. J. Cheng; C. K. Yen; C. C. Hsieh (Microelectron. Reliab., 2006)