P. J. Zheng

According to our database, P. J. Zheng authored at least 3 papers between 2001 and 2006.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2006

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.

J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee

Microelectron. Reliab., 2006

2002

Board level reliability of a stacked CSP subjected to cyclic bending.

J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung

Microelectron. Reliab., 2002

2001

Board level reliability of PBGA using flex substrate.

S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu

Microelectron. Reliab., 2001