Board level reliability of PBGA using flex substrate. - S. C. Hung; P. J. Zheng; S. H. Ho; S. C. Lee; H. N. Chen; J. D. Wu (Microelectron. Reliab., 2001)

Board level reliability of a stacked CSP subjected to cyclic bending. - J. D. Wu; S. H. Ho; C. Y. Huang; C. C. Liao; P. J. Zheng; S. C. Hung (Microelectron. Reliab., 2002)

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. - J. D. Wu; P. J. Zheng; C. W. Lee; S. C. Hung; J. J. Lee (Microelectron. Reliab., 2006)