Study of the self-alignment of no-flow underfill for micro-BGA assembly. - Y. C. Chan; P. L. Tu; K. C. Hung (Microelectron. Reliab., 2001)

Reliability of microBGA assembly using no-flow underfill. - P. L. Tu; Y. C. Chan; K. C. Hung (Microelectron. Reliab., 2001)

Study of micro-BGA solder joint reliability. - P. L. Tu; Y. C. Chan; K. C. Hung; J. K. L. Lai (Microelectron. Reliab., 2001)