An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages. - Ming-Yi Tsai; P. S. Huang; C. Y. Huang; P. C. Lin; Lawrence Huang; Michael Chang; Steven Shih; J. P. Lin (Microelectron. Reliab., 2014)

Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. - Ming-Yi Tsai; P. S. Huang; C. H. Lin; C. T. Wu; S. C. Hu (Microelectron. Reliab., 2015)