Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

Using TSVs for thermal mitigation in 3D circuits: Wish and truth. - Cristiano Santos; Papa Momar Souare; François de Crecy; Perceval Coudrain; Jean-Philippe Colonna; Pascal Vivet; Andras Borbely; Ricardo Reis 001; M. Haykel Ben Jamaa; Vincent Fiori; Alexis Farcy (3DIC, 2014)

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. - Perceval Coudrain; Papa Momar Souare; Rafael Prieto; Vincent Fiori; Alexis Farcy; Laurent Le Pailleur; Jean-Philippe Colonna; Cristiano Santos; Pascal Vivet; M. Haykel Ben Jamaa; Denis Dutoit; François de Crecy; et al. (IEEE Des. Test, 2016)