Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. - Chaoqi Zhang 001; Paragkumar Thadesar; Muneeb Zia; Thomas E. Sarvey; Muhannad S. Bakir (3DIC, 2014)

Fabrication of and cell growth on 'silicon membranes' with high density TSVs for bio-sensing applications. - Muneeb Zia; Chaoqi Zhang 001; Paragkumar Thadesar; Tracy Hookway; Taiyun Chi; Joe L. Gonzalez; Todd C. McDevitt; Hua Wang 006; Muhannad S. Bakir (BioCAS, 2015)

Embedded cooling technologies for densely integrated electronic systems. - Thomas E. Sarvey; Yang Zhang; Li Zheng; Paragkumar Thadesar; Ravi Gutala; Colman Cheung; Arifur Rahman; Muhannad S. Bakir (CICC, 2015)