3D integration technology for set-top box application. - David Henry; Séverine Cheramy; Jean Charbonnier; Pascal Chausse; Muriel Neyret; Cathy Brunet-Manquat; Sophie Verrun; Nicolas Sillon; Laurent Bonnot; Xavier Gagnard; E. Saugier (3DIC, 2009)

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sebastien Petitdidier; Norbert Chevrier; Sébastien Gallois-Garreignot; Alexis Farcy; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (3DIC, 2013)

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. - Amadine Jouve; Y. Sinquin; Arnaud Garnier; M. Daval; Pascal Chausse; M. Argoud; N. Allouti; Laurence Baud; Jérôme Dechamp; R. Franiatte; Séverine Cheramy; H. Kato; et al. (3DIC, 2015)

Stress management strategy to limit die curvature during silicon interposer integration. - Benjamin Vianne; Alexis Farcy; Vincent Fiori; Cédrick Chappaz; Norbert Chevrier; G. Lobascio; Pascal Chausse; F. Ponthenier; A. Ruckly; Stéphanie Escoubas; Olivier Thomas (3DIC, 2015)

Thermo-mechanical characterization of passive stress sensors in Si interposer. - Benjamin Vianne; Pierre Bar; Vincent Fiori; Sébastien Gallois-Garreignot; Komi-Atchou Ewuame; Pascal Chausse; Stéphanie Escoubas; Nicolas Hotellier; Olivier Thomas (Microelectron. Reliab., 2015)