An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method. - Haixia Shang; Jianxin Gao; Pascual Ian Nicholson; Steve Kenny (Microelectron. Reliab., 2011)

Introducing a novel mesh following technique for approximation-free robotic tool path trajectories. - Carmelo Mineo; Stephen Gareth Pierce; Pascual Ian Nicholson; Ian Cooper (J. Comput. Des. Eng., 2017)