The evaluation of mechanical stresses developed in underlying silicon substrates due to electroless nickel under bump metallization using synchrotron X-ray topography. - D. Noonan; Patrick J. McNally; Weimin Chen; Aapo Lankinen; L. Knuuttila; Turkka O. Tuomi; Andreas N. Danilewsky; Rolf Simon (Microelectron. J., 2006)

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. - Aidan Cowley; Andrej Ivankovic; C. S. Wong; N. S. Bennett; A. N. Danilewsky; Marcel Gonzalez; Vladimir Cherman; Bart Vandevelde; Ingrid De Wolf; Patrick J. McNally (Microelectron. Reliab., 2016)