An investigation of dielectric thickness scaling on BEOL TDDB. - Tian Shen; Wenyi Zhang; Kong Boon Yeap; Jing Tan; Walter Yao; Patrick Justison (IRPS, 2015)

Impact of electrode surface modulation on time-dependent dielectric breakdown. - Kong Boon Yeap; Tian Shen; Galor Wenyi Zhang; Sing Fui Yap; Brian Holt; Arfa Gondal; Seungman Choi; San Leong Liew; Walter Yao; Patrick Justison (IRPS, 2015)

An investigation of process dependence of porous IMD TDDB. - Wenyi Zhang; M. C. Silvestre; A. Selvam; E. Ramanathan; C. Ordonio; J. Schaller; Tian Shen; Kong Boon Yeap; C. Capasso; Patrick Justison; J. H. Lee (IRPS, 2015)

Effect of metal line width on electromigration of BEOL Cu interconnects. - Seungman Choi; Cathryn Christiansen; Linjun Cao; James Zhang; Ronald Filippi; Tian Shen; Kong Boon Yeap; Sean P. Ogden; Haojun Zhang; Bianzhu Fu; Patrick Justison (IRPS, 2018)

Reliability challenges for 2.5D/3D integration: An overview. - C. S. Premachandran; Seungman Choi; Salvatore Cimino; Thuy Tran-Quinn; Lloyd Burrell; Patrick Justison (IRPS, 2018)

New insight on TDDB area scaling methodology of non-Poisson systems. - Tian Shen; Kong Boon Yeap; Sean P. Ogden; Cathryn Christiansen; Patrick Justison (IRPS, 2018)

A Comprehensive Wafer Level Reliability Study on 65nm Silicon Interposer. - C. S. Premachandran; Thuy Tran-Quinn; Lloyd Burrell; Patrick Justison (IRPS, 2019)

Novel Oxide Top-Off Process Enabling Reliable PC-CA TDDB on IO Devices with Self Aligned Contact. - Tian Shen; Abu Naser Zainuddin; Purushothaman Srinivasan; Zakariae Chbili; Kai Zhao; Patrick Justison (IRPS, 2019)

Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. - Zhuo-Jie Wu; Ping-Chuan Wang; Seungman Choi; Patrick Justison; Martin Gall; Jae Kyu Cho; Takako Hirokawa; Yusheng Bian; Thomas Houghton; Vaishnavi Karra; Dan Moy; Karen Nummy; et al. (OFC, 2023)