Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix. - Patrick Le Maitre; Melanie Brocard; Alexis Farcy; Jean-Claude Marin (ISQED, 2012)

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. - Melanie Brocard; Cédric Bermond; Thierry Lacrevaz; Alexis Farcy; Patrick Le Maitre; P. Scheer; Patrick Leduc; Séverine Cheramy; Bernard Fléchet (3DIC, 2013)

Impact of process variability of active ring resonators in a 300mm silicon photonic platform. - Patrick Le Maitre; Jean Francois Carpentier; Charles Baudot; Nathalie Vulliet; Aurelie Souhaite; Jean-Baptiste Quelene; Thomas Ferrotti; Frédéric Boeuf (ECOC, 2015)

Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform. - Frédéric Boeuf; Sebastien Cremer; Enrico Temporiti; Massimo Fere; Mark Shaw 002; Nathalie Vulliet; Bastien Orlando; Delia Ristoiu; Alexis Farcy; Thierry Pinguet; Attila Mekis; Gianlorenzo Masini; et al. (OFC, 2015)

Silicon Photonics Platform from Datacom to Sensing Applications. - Frédéric Boeuf; Cyrille Barrera; Ismael Charlet; Michele Calvo; Antonio Fincato; Stéphane Monfray; Sylvain Guerber; Sebastien Cremer; Nathalie Vulliet; Jean Francois Carpentier; Luca Maggi; Daivid Fowler; et al. (BCICTS, 2021)