Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits. - Lionel Cadix; Alexis Farcy; Cédric Bermond; Christine Fuchs; Patrick Leduc; Maxime Rousseau; Myriam Assous; Alexandre Valentian; Julie Roullard; Elie Eid; Nicolas Sillon; Bernard Fléchet; et al. (3DIC, 2009)

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. - Léa Di Cioccio; Pierric Gueguen; Rachid Taibi; Thomas Signamarcheix; Laurent Bally; Laurent Vandroux; Marc Zussy; Sophie Verrun; Jérôme Dechamp; Patrick Leduc; Myriam Assous; David Bouchu; et al. (3DIC, 2009)

First integration of Cu TSV using die-to-wafer direct bonding and planarization. - Patrick Leduc; Myriam Assous; Léa Di Cioccio; Marc Zussy; Thomas Signamarcheix; Antonio Roman; Maxime Rousseau; Sophie Verrun; Laurent Bally; David Bouchu; Lionel Cadix; Alexis Farcy; et al. (3DIC, 2009)

System on Wafer: A New Silicon Concept in SiP. - Gilles Poupon; Nicolas Sillon; David Henry; Charlotte Gillot; Alan Mathewson; Léa Di Cioccio; Barbara Charlet; Patrick Leduc; Maud Vinet; Perrine Batude (Proc. IEEE, 2009)

A successful implementation of dual damascene architecture to copper TSV for 3D high density applications. - Rebha El Farhane; Myriam Assous; Patrick Leduc; Aurélie Thuaire; David Bouchu; Hélène Feldis; Nicolas Sillon (3DIC, 2010)

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. - Melanie Brocard; Cédric Bermond; Thierry Lacrevaz; Alexis Farcy; Patrick Le Maitre; P. Scheer; Patrick Leduc; Séverine Cheramy; Bernard Fléchet (3DIC, 2013)

Which interconnects for which 3D applications? Status and perspectives. - Yann Lamy; Jean-Philippe Colonna; G. Simon; Patrick Leduc; Séverine Cheramy; C. Laviron (3DIC, 2013)

Panel: "will 3D-IC remain a technology of the future... even in the future?". - Marco Casale-Rossi; Patrick Leduc; Giovanni De Micheli; Patrick Blouet; Brendan Farley; Anna Fontanelli; Dragomir Milojevic; Steve Smith (DATE, 2013)

Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric. - Thomas Frank; Stéphane Moreau; Cédrick Chappaz; Patrick Leduc; Lucile Arnaud; Aurélie Thuaire; Emmanuel Chery; F. Lorut; Lorena Anghel; Gilles Poupon (Microelectron. Reliab., 2013)