Characterization method of thermomechanical parameters for microelectronic materials. - Oliver Perat; Jean-Marie Dorkel; Emmanuel Scheid; Pierre Temple-Boyer; Y. S. Chung; A. Peyre-Lavigne; M. Zecri; Patrick Tounsi (Microelectron. Reliab., 2002)

Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue. - B. Khong; Patrick Tounsi; Philippe Dupuy; X. Chauffleur; Marc Legros; A. Deram; Colette Levade; G. Vanderschaeve; Jean-Marie Dorkel; Jean-Pierre Fradin (Microelectron. Reliab., 2005)

Characterization and modelling of ageing failures on power MOSFET devices. - B. Khong; Marc Legros; Patrick Tounsi; Philippe Dupuy; X. Chauffleur; Colette Levade; G. Vanderschaeve; Emmanuel Scheid (Microelectron. Reliab., 2007)

Performance and reliability testing of modern IGBT devices under typical operating conditions of aeronautic applications. - Jean-Luc Fock Sui Too; B. Chauchat; Patrick Austin; Patrick Tounsi; Michel Mermet-Guyennet; Régis Meuret (Microelectron. Reliab., 2008)

3D electro-thermal investigations for reliability of ultra low ON state resistance power MOSFET. - Jean-Baptiste Sauveplane; Patrick Tounsi; Emmanuel Scheid; A. Deram (Microelectron. Reliab., 2008)

3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs. - Toufik Azoui; Patrick Tounsi; Philippe Dupuy; L. Guillot; Jean-Marie Dorkel (Microelectron. Reliab., 2011)

Innovative methodology to extract dynamic compact thermal models: Application to power devices. - Toufik Azoui; Patrick Tounsi; Jean-Marie Dorkel (Microelectron. J., 2012)

Study of mechanical stress impact on the I-V characteristics of a power VDMOS device using 2D FEM simulations. - Emmanuel Marcault; Marie Breil; A. Bourennane; Patrick Tounsi; Jean-Marie Dorkel (Microelectron. Reliab., 2012)

Distributed electrothermal modeling methodology for MOS gated power devices simulations. - Emmanuel Marcault; Jean-Luc Massol; Patrick Tounsi; Jean-Marie Dorkel (MIXDES, 2013)

Estimation of power MOSFET junction temperature during avalanche mode: Experimental tests and modelling. - Toufik Azoui; Patrick Tounsi; Jean-Marie Dorkel; Jean-Michel Reynes; Jean-Luc Massol; E. Pomes (Microelectron. Reliab., 2013)

New testing approach using near electromagnetic field probing intending to upgrade in-circuit testing of high density PCBAs. - Nabil El Belghiti Alaoui; Patrick Tounsi; Alexandre Boyer; Arnaud Viard (NATW, 2018)

Upgrading In-Circuit Test of High Density PCBAs Using Electromagnetic Measurement and Principal Component Analysis. - Nabil El Belghiti Alaoui; Alexandre Boyer; Patrick Tounsi; Arnaud Viard (J. Electron. Test., 2018)

New defect detection approach using near electromagnetic field probing of high density PCBAs. - Nabil El Belghiti Alaoui; Alexandre Boyer; Patrick Tounsi; Arnaud Viard (Microelectron. Reliab., 2018)

Detecting PCB Assembly Defects Using Infrared Thermal Signatures. - Nabil El Belghiti Alaoui; Patrick Tounsi; Alexandre Boyer; Arnaud Viard (MIXDES, 2019)

Using Compact Thermal Modelling for the Investigation of a Cooling System Dysfunction Applied to a Power Module with Double Sided Cooling. - Anaïs Cassou; Patrick Tounsi; Jean-Pierre Fradin (MIXDES, 2019)

Development of SiC MOSFET Electrical Model and Experimental Validation: Improvement and Reduction of Parameter Number. - Quang Chuc Nguyen; Patrick Tounsi; Jean-Pierre Fradin; Jean-Michel Reynes (MIXDES, 2019)