Impact of oxide liner properties on TSV Cu pumping and TSV stress. - Joke De Messemaeker; O. Varela Pedreira; A. Moussa; Nabi Nabiollahi; Kris Vanstreels; Stefaan Van Huylenbroeck; Harold Philipsen; Patrick Verdonck; Bart Vandevelde; Ingrid De Wolf; Eric Beyne; Kris Croes (IRPS, 2015)

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill. - Alicja Lesniewska; Philippe J. Roussel; Davide Tierno; Victor Vega-Gonzalez; Marleen H. van der Veen; Patrick Verdonck; Nicolas Jourdan 002; Christopher J. Wilson; Zsolt Tökei; Kris Croes (IRPS, 2020)