Opportunities brought by sequential 3D CoolCube™ integration. - Maud Vinet; Perrine Batude; Claire Fenouillet-Béranger; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ESSDERC, 2016)

Recent advances in 3D VLSI integration. - Claire Fenouillet-Béranger; Perrine Batude; Laurent Brunet; Vincent Mazzocchi; Cao-Minh Vincent Lu; Fabien Deprat; Jessy Micout; M.-P. Samson; Bernard Previtali; Paul Besombes; Nils Rambal; François Andrieu; et al. (ICICDT, 2016)

Guidelines for intermediate back end of line (BEOL) for 3D sequential integration. - Claire Fenouillet-Béranger; S. Beaurepaire; Fabien Deprat; Alexandre Ayres De Sousa; Laurent Brunet; Perrine Batude; Olivier Rozeau; François Andrieu; Paul Besombes; M.-P. Samson; Bernard Previtali; F. Nemouchi; et al. (ESSDERC, 2017)

16kbit 1T1R OxRAM arrays embedded in 28nm FDSOI technology demonstrating low BER, high endurance, and compatibility with core logic transistors. - Laurent Grenouillet; Niccolo Castellani; Alain Persico; Valentina Meli; Simon Martin 006; Olivier Billoint; R. Segaud; Stefania Bernasconi; C. Pellissier; Carine Jahan; Christelle Charpin-Nicolle; P. Dezest; et al. (IMW, 2021)