3D direct vertical interconnect microprocessors test vehicle. - John Mayega; Okan Erdogan; Paul M. Belemjian; Kuan Zhou; John F. McDonald 001; Russell P. Kraft (ACM Great Lakes Symposium on VLSI, 2003)

Predicting the Performance of a 3D Processor-Memory Chip Stack. - Philip Jacob 001; Okan Erdogan; Aamir Zia; Paul M. Belemjian; Russell P. Kraft; John F. McDonald 001 (IEEE Des. Test Comput., 2005)

SiGe HBT Microprocessor Core Test Vehicle. - Paul M. Belemjian; Okan Erdogan; Russell P. Kraft; John F. McDonald 001 (Proc. IEEE, 2005)

Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. - Philip Jacob 001; Aamir Zia; Okan Erdogan; Paul M. Belemjian; Peng Jin; Jin Woo Kim; Michael Chu; Russell P. Kraft; John F. McDonald 001 (ICCD, 2007)

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. - John F. McDonald 001; Okan Erdogan; Philip Jacob 001; Paul M. Belemjian; Alexey Gutin; Aamir Zia; Michael Chu; Jin Woo Kim; Ryan Clarke; Nate DeSimone; Sherry Liu; Russell P. Kraft (3DIC, 2009)

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks. - Philip Jacob 001; Aamir Zia; Okan Erdogan; Paul M. Belemjian; Jin Woo Kim; Michael Chu; Russell P. Kraft; John F. McDonald 001; Kerry Bernstein (Proc. IEEE, 2009)

Carry Chains for Ultra High-Speed SiGe HBT Adders. - Alexey Gutin; Philip Jacob 001; Michael Chu; Paul M. Belemjian; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Circuits Syst. I Regul. Pap., 2011)