Substrate potential shift due to parasitic minority carrier injection in smart-power ICs: measurements and full-chip 3D device simulation. - Michael Schenkel; Paul Pfäffli; Wolfgang Wilkening; D. Aemmer; Wolfgang Fichtner (Microelectron. Reliab., 2001)

TCAD for reliability. - Paul Pfäffli; P. Tikhomirov; X. Xu; I. Avci; Y.-S. Oh; P. Balasingam; S. Krishnamoorthy; T. Ma (Microelectron. Reliab., 2012)

TCAD modeling for reliability. - Paul Pfäffli; Hiu Yung Wong; X. Xu; Luca Silvestri; X. W. Lin; T. Yang; Ravi Tiwari; Souvik Mahapatra; Steve Motzny; Victor Moroz; Terry Ma (Microelectron. Reliab., 2018)