Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures. - Jie-Hua Zhao; Wen-Jie Qi; Paul S. Ho (Microelectron. Reliab., 2002)

Electromigration reliability issues in dual-damascene Cu interconnections. - Ennis T. Ogawa; Ki-Don Lee; Volker A. Blaschke; Paul S. Ho (IEEE Trans. Reliab., 2002)

Reliability issues for flip-chip packages. - Paul S. Ho; Guotao Wang; Min Ding 003; Jie-Hua Zhao; Xiang Dai (Microelectron. Reliab., 2004)

A two-chip, 4-MHz, microelectromechanical reference oscillator. - Krishnakumar Sundaresan; Paul S. Ho; Siavash Pourkamali; Farrokh Ayazi (ISCAS (6), 2005)

Chip-packaging interaction: a critical concern for Cu/low k packaging. - Guotao Wang; Paul S. Ho; Steven Groothuis (Microelectron. Reliab., 2005)

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints. - Brook Huang-Lin Chao; Xuefeng Zhang; Seung-Hyun Chae; Paul S. Ho (Microelectron. Reliab., 2009)

Measurement and analysis of thermal stresses in 3D integrated structures containing through-silicon-vias. - Tengfei Jiang; Suk-Kyu Ryu; Qiu Zhao; Jay Im; Rui Huang; Paul S. Ho (Microelectron. Reliab., 2013)

Effects of Wiring Density and Pillar Structure on Chip Package Interaction for Advanced Cu Low-k Chips. - Weishen Chu; Laura Spinella; Dwayne R. Shirley; Paul S. Ho (IRPS, 2020)