Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. - Pearl A. Agyakwa; Martin R. Corfield; Li Yang; Jianfeng Li 002; V. M. F. Marques; C. Mark Johnson (Microelectron. Reliab., 2011)

A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects. - Li Yang; Pearl A. Agyakwa; C. Mark Johnson (Microelectron. Reliab., 2011)

Degradation of thermal interface materials for high-temperature power electronics applications. - Robert Skuriat; Jianfeng Li 002; Pearl A. Agyakwa; Nevil Mattey; Paul Evans; C. Mark Johnson (Microelectron. Reliab., 2013)

Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. - Elaheh Arjmand; Pearl A. Agyakwa; C. Mark Johnson (Microelectron. Reliab., 2014)

A thermal cycling reliability study of ultrasonically bonded copper wires. - Elaheh Arjmand; Pearl A. Agyakwa; Martin R. Corfield; Jianfeng Li 002; Bassem Mouawad; C. Mark Johnson (Microelectron. Reliab., 2016)

Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement. - Mohd. Amir Eleffendi; Li Yang; Pearl A. Agyakwa; C. Mark Johnson (Microelectron. Reliab., 2016)