Impact of component placement in solder joint reliability. - T. Alander; S. Nurmi; Pekka Heino; Eero Ristolainen (Microelectron. Reliab., 2002)

Evaluation Of Resonating Channel Transistor In SOI Wafer. - S. Myllymaki; Eero Ristolainen; Pekka Heino; A. Lehto; K. Varjonen (Int. J. Comput. Eng. Sci., 2003)

Thermal conduction at the nanoscale in some metals by MD. - Pekka Heino; Eero Ristolainen (Microelectron. J., 2003)

Strength of Ta-Si interfaces by molecular dynamics. - Pekka Heino; Eero Ristolainen (Microelectron. Reliab., 2003)

Space-Saving Layout for Passive Components. - Päivi H. Karjalainen; Pekka Heino (ISVLSI, 2006)

Wireless and inductively powered implant for measuring electrocardiogram. - Jarno Riistama; Juho Väisänen; Sami Heinisuo; Hanna Harjunpää; Satu Arra; Kati Kokko; Maunu Mäntylä; Jutta Kaihilahti; Pekka Heino; Minna Kellomäki; Outi Vainio; Jukka Vanhala; et al. (Medical Biol. Eng. Comput., 2007)

Method for Measuring Parylene Thickness Using Quartz Crystal Microbalance. - Henna Heinilä; Maunu Mäntylä; Pekka Heino (BIODEVICES (2), 2008)

Influence of medical sterilization on ACA flip chip joints using conformal coating. - Kati Kokko; Hanna Harjunpää; Pekka Heino; Minna Kellomäki (Microelectron. Reliab., 2009)

Lattice-Boltzmann finite-difference model with optical phonons for nanoscale thermal conduction. - Pekka Heino (Comput. Math. Appl., 2010)

Accelerated testing for failures of tantalum capacitors. - Johanna Virkki; Tomi Seppälä; Laura Frisk; Pekka Heino (Microelectron. Reliab., 2010)