Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies. - Cheng-Ta Ko; Zhi-Cheng Hsiao; Y. J. Chang; Peng-Shu Chen; J. H. Huang; Hsin-Chia Fu; Y. J. Huang; C. W. Chiang; W. L. Tsat; Y. H. Chen; Wei-Chung Lo; Kuan-Neng Chen (3DIC, 2011)

Performance and process characteristic of glass interposer with through-glass-via(TGV). - Chun-Hsien Chien; Hsun Yu; Ching-Kuan Lee; Yu-Min Lin; Ren-Shin Cheng; Chau-Jie Zhan; Peng-Shu Chen; Chang-Chih Liu; Chao-Kai Hsu; Hsiang-Hung Chang; Huan-Chun Fu; Yuan-Chang Lee; et al. (3DIC, 2013)