3D integration demonstration of a wireless product with design partitioning. - G. Druais; Pascal Ancey; C. Aumont; V. Caubet; Laurent-Luc Chapelon; C. Chaton; Séverine Cheramy; S. Cordova; E. Cirot; Jean-Philippe Colonna; Perceval Coudrain; T. Divel; et al. (3DIC, 2011)

3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS. - Perrine Batude; Thomas Ernst 005; Julien Arcamone; Gregory Arndt; Perceval Coudrain; Pierre-Emmanuel Gaillardon (IEEE J. Emerg. Sel. Topics Circuits Syst., 2012)

Chip to wafer copper direct bonding electrical characterization and thermal cycling. - Yann Beilliard; Perceval Coudrain; Léa Di Cioccio; Stéphane Moreau; Loic Sanchez; Brigitte Montmayeul; Thomas Signamarcheix; Rafael Estevez; Guillaume Parry (3DIC, 2013)

Thermal correlation between measurements and FEM simulations in 3D ICs. - Papa Momar Souare; François de Crecy; Vincent Fiori; M. Haykel Ben Jamaa; Alexis Farcy; Sébastien Gallois-Garreignot; Andras Borbely; Jean-Philippe Colonna; Perceval Coudrain; B. Giraud; C. Laviron; Séverine Cheramy; et al. (3DIC, 2013)

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. - Yann Beilliard; Stéphane Moreau; Léa Di Cioccio; Perceval Coudrain; G. Romano; A. Nowodzinski; F. Aussenac; P.-H. Jouneau; E. Rolland; Thomas Signamarcheix (3DIC, 2014)

Using TSVs for thermal mitigation in 3D circuits: Wish and truth. - Cristiano Santos; Papa Momar Souare; François de Crecy; Perceval Coudrain; Jean-Philippe Colonna; Pascal Vivet; Andras Borbely; Ricardo Reis 001; M. Haykel Ben Jamaa; Vincent Fiori; Alexis Farcy (3DIC, 2014)

Thermal performance of 3D ICs: Analysis and alternatives. - Cristiano Santos; Pascal Vivet; Jean-Philippe Colonna; Perceval Coudrain; Ricardo Augusto da Luz Reis (3DIC, 2014)

Graphite-based heat spreaders for hotspot mitigation in 3D ICs. - Cristiano Santos; Rafael Prieto; Pascal Vivet; Jean-Philippe Colonna; Perceval Coudrain; Ricardo Reis 001 (3DIC, 2015)

Heat spreading packaging solutions for hybrid bonded 3D-ICs. - Rafael Prieto; Perceval Coudrain; Jean-Philippe Colonna; Y. Hallez; Christian Chancel; Venceslass Rat; Sylvain Dumas; G. Romano; R. Franiatte; C. Brunet-Manquiat; Séverine Cheramy; Alexis Farcy (3DIC, 2016)

Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. - Cristiano Santos; Pascal Vivet; Sébastien Thuries; Olivier Billoint; Jean-Philippe Colonna; Perceval Coudrain; Lee Wang (3DIC, 2016)

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. - Perceval Coudrain; Papa Momar Souare; Rafael Prieto; Vincent Fiori; Alexis Farcy; Laurent Le Pailleur; Jean-Philippe Colonna; Cristiano Santos; Pascal Vivet; M. Haykel Ben Jamaa; Denis Dutoit; François de Crecy; et al. (IEEE Des. Test, 2016)

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; Guillaume Moritz; Ivan Miro-Panades; César Fuguet Tortolero; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (ISSCC, 2020)

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. - Pascal Vivet; Eric Guthmuller; Yvain Thonnart; Gaël Pillonnet; César Fuguet Tortolero; Ivan Miro-Panades; Guillaume Moritz; Jean Durupt; Christian Bernard; Didier Varreau; Julian J. H. Pontes; Sébastien Thuries; et al. (IEEE J. Solid State Circuits, 2021)