Assessing the risk of "Kirkendall voiding" in Cu3Sn. - Peter Borgesen; Liang Yin; Pericles Kondos (Microelectron. Reliab., 2011)

Acceleration of the growth of Cu3Sn voids in solder joints. - Peter Borgesen; Liang Yin; Pericles Kondos (Microelectron. Reliab., 2012)