Direct gold and copper wires bonding on copper. - Hong Meng Ho; Wai Lam; Serguei Stoukatch; Petar Ratchev; Charles J. Vath; Eric Beyne (Microelectron. Reliab., 2003)

Creep as a reliability problem in MEMS. - Robert Modlinski; Ann Witvrouw; Petar Ratchev; Anne Jourdain; Veerle Simons; H. A. C. Tilmans; Jaap M. J. den Toonder; Robert Puers; Ingrid De Wolf (Microelectron. Reliab., 2004)

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads. - Petar Ratchev; Serguei Stoukatch; Bart Swinnen (Microelectron. Reliab., 2006)

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. - Bart Vandevelde; Mario Gonzalez; Paresh Limaye; Petar Ratchev; Eric Beyne (Microelectron. Reliab., 2007)