Assessing the risk of "Kirkendall voiding" in Cu3Sn. - Peter Borgesen; Liang Yin; Pericles Kondos (Microelectron. Reliab., 2011)

Acceleration of the growth of Cu3Sn voids in solder joints. - Peter Borgesen; Liang Yin; Pericles Kondos (Microelectron. Reliab., 2012)

Solder joint reliability under realistic service conditions. - Peter Borgesen; S. Hamasha; Mazin Obaidat; V. Raghavan; X. Dai; Michael Meilunas; M. Anselm (Microelectron. Reliab., 2013)

Effects of 'Latent Damage' on pad cratering: Reduction in life and a potential change in failure mode. - Venkatesh Arasanipalai Raghavan; Brian Roggeman; Michael Meilunas; Peter Borgesen (Microelectron. Reliab., 2013)

Effects of latent damage of recrystallization on lead free solder joints. - Ahmad Mayyas; Awni Qasaimeh; Peter Borgesen; Michael Meilunas (Microelectron. Reliab., 2014)