Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications. - Alvin J. Joseph; John D. Gillis; Mark Doherty; Peter J. Lindgren; Rosemary A. Previti-Kelly; Ramana M. Malladi; Ping-Chuan Wang; Mete Erturk; Hanyi Ding; Ephrem G. Gebreselasie; Michael J. McPartlin; James S. Dunn (IBM J. Res. Dev., 2008)