HBT transmitter and data regenerator arrays for WDM optical communications application. - Kenneth D. Pedrotti; F. Zucca; Peter J. Zampardi; K. Nary; Steve M. Beccue; Klaus Runge; D. Meeker; J. Penny; K. C. Wang (IEEE J. Solid State Circuits, 1995)

A comparison of linear handset power amplifiers in different bipolar technologies. - Keith Nellis; Peter J. Zampardi (IEEE J. Solid State Circuits, 2004)

Characterization, design, modeling, and model validation of silicon-wafer M: N balun components under matched and unmatched conditions. - Francis M. Rotella; Cristian Cismaru; Yevgeniy Gene Tkachenko; Yuhua Cheng; Peter J. Zampardi (IEEE J. Solid State Circuits, 2006)

Introduction to the Special Issue on the Third IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS). - Peter Katzin; Peter J. Zampardi (IEEE J. Solid State Circuits, 2007)

An InGaP/GaAs Merged HBT-FET (BiFET) Technology and Applications to the Design of Handset Power Amplifiers. - Andre G. Metzger; Ravi Ramanathan; Jiang Li; Hsiang-Chih Sun; Cristian Cismaru; Hongxiao Shao; Lance Rushing; Kenneth P. Weller; Ce-Jun Wei; Yu Zhu; Alexei Klimashov; Yevgeniy A. Tkachenko; et al. (IEEE J. Solid State Circuits, 2007)

Will CMOS amplifiers ever Kick-GaAs? - Peter J. Zampardi (CICC, 2010)

Measuring seam/crack formation in interconnect metallization. - Peter J. Zampardi; Cristian Cismaru; Hal Banbrook; Bin Li (Microelectron. Reliab., 2012)

Formulations and a Computer-Aided Test Method for the Estimation of IMD Levels in an Envelope Feedback RFIC Power Amplifier. - Nicolas G. Constantin; Kai H. Kwok; Hongxiao Shao; Cristian Cismaru; Peter J. Zampardi (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2012)

Evaluation of thermal balancing techniques in InGaP/GaAs HBT power arrays for wireless handset power amplifiers. - Andre G. Metzger; Vincenzo d'Alessandro; Niccolò Rinaldi; Peter J. Zampardi (Microelectron. Reliab., 2013)

Determination of safe reliability region over temperature and current density for through wafer vias. - Charles S. Whitman; Michael G. Meeder; Peter J. Zampardi (Microelectron. Reliab., 2017)

Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies. - Vincenzo d'Alessandro; Antonio Pio Catalano; Alessandro Magnani; Lorenzo Codecasa; Niccolò Rinaldi; Brian Moser; Peter J. Zampardi (Microelectron. Reliab., 2017)

From Transistor Parameters to PA Circuit Performance (Invited). - Peter J. Zampardi (BCICTS, 2021)

Improving Performance of InGaP/GaAs HBT Arrays by means of Temperature-Dependent Base Ballasting Resistors. - Ciro Scognamillo; Antonio Pio Catalano; Vincenzo d'Alessandro; Peter J. Zampardi; Kerry Burger (PRIME, 2023)