Micro-sectioning approach for quality and reliability assessment of wire bonding interfaces in IGBT modules. - Kristian Bonderup Pedersen; Peter Kjær Kristensen; Vladimir N. Popok; Kjeld Pedersen (Microelectron. Reliab., 2013)

Effects of thermal cycling on aluminum metallization of power diodes. - Mads Brincker; Kristian Bonderup Pedersen; Peter Kjær Kristensen; Vladimir N. Popok (Microelectron. Reliab., 2015)

Mechanisms of metallization degradation in high power diodes. - Mads Brincker; Peter Kjær Kristensen; Kristian Bonderup Pedersen; Vladimir N. Popok (Microelectron. Reliab., 2016)

Comprehensive physical analysis of bond wire interfaces in power modules. - Vladimir N. Popok; Kristian Bonderup Pedersen; Peter Kjær Kristensen; Kjeld Pedersen (Microelectron. Reliab., 2016)

Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects - A novel approach for hybrid metal baseplates. - Mads Brincker; Peter Kjær Kristensen; S. Söhl; R. Eisele; Vladimir N. Popok (Microelectron. Reliab., 2018)