Automated solder joint inspection system using optical 3-D image detection. - Yukio Matsuyama; Toshifumi Honda; Hisae Yamamura; Hideaki Sasazawa; Mineo Nomoto; Takanori Ninomiya; Anton Schick; Ludwig Listl; Paul Köllensperger; Dieter Spriegel; Peter Mengel; Richard Schneider (WACV, 1996)

Fast range imaging by CMOS sensor array through multiple double short time integration (MDSI). - Peter Mengel; Günter Doemens; Ludwig Listl (ICIP (2), 2001)

A 4×64 pixel CMOS image sensor for 3D measurement applications. - Olaf M. Schrey; O. Elkhalili; Peter Mengel; M. Petermann; Werner Brockherde; Bedrich J. Hosticka (ESSCIRC, 2003)

A 4×64 pixel CMOS image sensor for 3-D measurement applications. - O. Elkhalili; Olaf M. Schrey; Peter Mengel; M. Petermann; Werner Brockherde; Bedrich J. Hosticka (IEEE J. Solid State Circuits, 2004)