Technologies for 3D Heterogeneous Integration - Jürgen Wolf; Peter Ramm; Armin Klumpp; Herbert Reichl (CoRR, 2008)

Through Silicon Vias as Enablers for 3D Systems - E. Jung; Andreas Ostmann; Peter Ramm; Jürgen Wolf; Michael Toepper; Maik Wiemer (CoRR, 2008)

High performance 3D interconnects based on electrochemical etch and liquid metal fill. - Harry Hedler; Thomas Scheiter; Markus Schieber; Armin Klumpp; Peter Ramm (3DIC, 2010)

3D-integration of silicon devices: A key technology for sophisticated products. - Armin Klumpp; Peter Ramm; Robert Wieland (DATE, 2010)

3D Integration technology: Status and application development. - Peter Ramm; Armin Klumpp; Josef Weber; Nicolas Lietaer; Maaike Taklo; Walter De Raedt; Thomas Fritzsch; Pascal Couderc (ESSCIRC, 2010)

Current and future 3D activities at Fraunhofer. - Andy Heinig; Muhammad Waqas Chaudhary; Peter Schneider; Peter Ramm; Josef Weber (3DIC, 2015)

3D TSV based high frequency components for RF IC and RF MEMS applications. - Montserrat Fernandez-Bolaños; Wolfgang A. Vitale; Mariazel Maqueda Lopez; Adrian M. Ionescu; Armin Klumpp; Karl-Reinhard Merkel; Josef Weber; Peter Ramm; Ilja Ocket; Walter De Raedt; Amin Enayati (3DIC, 2016)

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration. - Peter Ramm; Armin Klumpp; Christof Landesberger; Josef Weber; Andy Heinig; Peter Schneider; Günter Elst; Manfred Engelhardt (3DIC, 2019)

Energy Autonomous Wearable Sensors for Smart Healthcare: A Review. - Abhishek Singh Dahiya; Jerome Thireau; Jamila Boudaden; Swatchith Lal; Umair Gulzar; Yan Zhang; Thierry Gil; Nadine Azémard; Peter Ramm; Tim Kiessling; Cian O'Murchu; Fredrik Sebelius; et al. (CoRR, 2019)