Laser ReSeal - Combination of Accelerometer and Gyroscope Sensors in a Single MEMS Chip Silicon Wafer Processing Technology for Six Degrees of Freedom in Inertial Sensors. - Holger Rumpf; Jens Frey; Kurt-Ulrich Ritzau; Achim Breitling; Peter Staffeld; Mawuli Ametowobla (IEEE SENSORS, 2020)