Predicting the Performance of a 3D Processor-Memory Chip Stack. - Philip Jacob 001; Okan Erdogan; Aamir Zia; Paul M. Belemjian; Russell P. Kraft; John F. McDonald 001 (IEEE Des. Test Comput., 2005)

Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. - Philip Jacob 001; Aamir Zia; Okan Erdogan; Paul M. Belemjian; Peng Jin; Jin Woo Kim; Michael Chu; Russell P. Kraft; John F. McDonald 001 (ICCD, 2007)

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. - John F. McDonald 001; Okan Erdogan; Philip Jacob 001; Paul M. Belemjian; Alexey Gutin; Aamir Zia; Michael Chu; Jin Woo Kim; Ryan Clarke; Nate DeSimone; Sherry Liu; Russell P. Kraft (3DIC, 2009)

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks. - Philip Jacob 001; Aamir Zia; Okan Erdogan; Paul M. Belemjian; Jin Woo Kim; Michael Chu; Russell P. Kraft; John F. McDonald 001; Kerry Bernstein (Proc. IEEE, 2009)

A 40 Gs/s Time Interleaved ADC Using SiGe BiCMOS Technology. - Michael Chu; Philip Jacob 001; Jin Woo Kim; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE J. Solid State Circuits, 2010)

Correction to "A 40 GS/s Time Interleaved ADC Using SiGe BiCMOS Technology". - Michael Chu; Philip Jacob 001; Jin Woo Kim; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE J. Solid State Circuits, 2010)

A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration. - Aamir Zia; Philip Jacob 001; Jin Woo Kim; Michael Chu; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Very Large Scale Integr. Syst., 2010)

Serial code accelerators for heterogeneous multi-core processor with 3D stacked memory. - Philip Jacob 001 (2010)

Reconfigurable 40 GHz BiCMOS uniform delay crossbar switch for broadband and wide tuning range narrowband applications. - Jin Woo Kim; Michael Chu; Philip Jacob 001; Aamir Zia; Russell P. Kraft; John F. McDonald 001 (IET Circuits Devices Syst., 2011)

Carry Chains for Ultra High-Speed SiGe HBT Adders. - Alexey Gutin; Philip Jacob 001; Michael Chu; Paul M. Belemjian; Mitchell R. LeRoy; Russell P. Kraft; John F. McDonald 001 (IEEE Trans. Circuits Syst. I Regul. Pap., 2011)

Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU. - Ryan Clarke; Philip Jacob 001; Okan Erdogan; Paul Belemijian; Srikumar Raman; Mitchell R. LeRoy; Tuhin Guha Neogi; Russell P. Kraft; Diana-Andra Borca-Tasciuc; John F. McDonald 001 (IEEE Access, 2015)