High-density and low-leakage novel embedded 3D MIM capacitor on Si interposer. - C. Roda Neve; Mikael Detalle; Philip Nolmans; Yunlong Li; Joeri De Vos; Geert Van der Plas; Gerald Beyer; Eric Beyne (3DIC, 2016)

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. - Luka Kljucar; Mario Gonzalez; Kristof Croes; Ingrid De Wolf; Joke De Messemaeker; Gayle Murdoch; Philip Nolmans; Joeri De Vos; Jürgen Bömmels; Eric Beyne; Zsolt Tökei (Microelectron. Reliab., 2017)

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor. - Hesheng Lin; Dimitrios Velenis; Philip Nolmans; Xiao Sun; Francky Catthoor; Rudy Lauwereins; Geert Van der Plas; Eric Beyne (IEEE Trans. Very Large Scale Integr. Syst., 2022)