Advantage of In-situ over Ex-situ techniques as reliability tool: Aging kinetics of Imec's MCM-D discrete passives devices. - Philippe Soussan; G. Lekens; R. Dreesen; Ward De Ceuninck; Eric Beyne (Microelectron. Reliab., 2003)

24 GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors. - Olivier Dupuis; Xiao Sun; Geert Carchon; Philippe Soussan; Mattias Ferndahl; Stefaan Decoutere; Walter De Raedt (ESSCIRC, 2005)

Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. - Yann Civale; Deniz Sabuncuoglu Tezcan; Harold G. G. Philipsen; P. Jaenen; Rahul Agarwal; F. Duval; Philippe Soussan; Youssef Travaly; Eric Beyne (3DIC, 2009)

A novel concept for ultra-low capacitance via-last TSV. - Yann Civale; Marcel Gonzalez; Deniz Sabuncuoglu Tezcan; Youssef Travaly; Philippe Soussan; Eric Beyne (3DIC, 2010)

A 300mm CMOS-Compatible PECVD Silicon Nitride Platform for Integrated Photonics with Low Loss and Low Process Induced Phase Variation. - Sandeep S. Saseendran; Tangla D. Kongnyuy; Bruno Figeys; Federico Buja; Benedetto Troia; Sarp Kerman; Aleksandrs Marinins; Roelof Jansen; Xavier Rottenberg; Deniz Sabuncuoglu Tezcan; Philippe Soussan (OFC, 2019)

III-V-on-Silicon-Nitride Mode-Locked Lasers. - Bart Kuyken; Stijn Cuyvers; Artur Hermans; Stijn Poelman; Camiel Op de Beeck; Bahawal Haq; Kasper Van Gasse; Jon Ø. Kjellman; Charles Caër; Günther Roelkens; Philippe Soussan; Xavier Rottenberg (OFC, 2022)