An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. - Léa Di Cioccio; Pierric Gueguen; Rachid Taibi; Thomas Signamarcheix; Laurent Bally; Laurent Vandroux; Marc Zussy; Sophie Verrun; Jérôme Dechamp; Patrick Leduc; Myriam Assous; David Bouchu; et al. (3DIC, 2009)

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. - Ionut Radu; Didier Landru; Gweltaz Gaudin; Gregory Riou; Catherine Tempesta; Fabrice Letertre; Léa Di Cioccio; Pierric Gueguen; Thomas Signamarcheix; C. Euvrard; Jérôme Dechamp; Laurent Clavelier; et al. (3DIC, 2010)

Low temperature direct bonding: An attractive technique for heterostructures build-up. - H. Moriceau; F. Rieutord; F. Fournel; Léa Di Cioccio; C. Moulet; Luc Libralesso; Pierric Gueguen; Rachid Taibi; C. Deguet (Microelectron. Reliab., 2012)