Characterization and fatigue damage simulation in SAC solder joints. - Müge Erinc; Piet J. G. Schreurs; G. Q. Zhang; Marc G. D. Geers (Microelectron. Reliab., 2004)

Characterization and Modelling of Moisture Driven Interface Failures. - Marcel A. J. van Gils; P. J. J. H. A. Habets; G. Q. Zhang; Willem D. van Driel; Piet J. G. Schreurs (Microelectron. Reliab., 2004)

Residual stresses in microelectronics induced by thermoset packaging materials during cure. - Marcel H. H. Meuwissen; Hedzer A. de Boer; Henk L. A. H. Steijvers; Piet J. G. Schreurs; Marc G. D. Geers (Microelectron. Reliab., 2004)