Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding. - Alain Phommahaxay; Anne Jourdain; Greet Verbinnen; Tobias Woitke; Peter Bisson; Markus Gabriel; Walter Spiess; Alice Guerrero; Jeremy McCutcheon; Rama Puligadda; Pieter Bex; Axel Van den Eede; et al. (3DIC, 2011)

Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)

Process Complexity and Cost Considerations of Multi-Layer Die Stacks. - Dimitrios Velenis; Joeri De Vos; Soon-Wook Kim; Jaber Derakhshandeh; Pieter Bex; Giovanni Capuz; Samuel Suhard; Kenneth June Rebibis; Stefaan Van Huylenbroeck; Erik Jan Marinissen; Alain Phommahaxay; Andy Miller; et al. (3DIC, 2019)

(Why do we need) Wireless Heterogeneous Integration (anyway?). - Michaël Peeters; S. Sinha; Xiao Sun; Claude Desset; Giuseppe Gramegna; John Slabbekoorn; Pieter Bex; Nelson Pinho; Tomas Webers; Dimitrios Velenis; Andy Miller; Nadine Collaert; et al. (VLSI Technology and Circuits, 2022)

Highly Optimized O-band Si Ring Modulators for Low-Power Hybrid CMOS-SiPho Transceivers. - Yoojin Ban; Minkyu Kim; Peter De Heyn; Davide Guermandi; Filippo Ferraro; Natarajan Rajasekaran; Peter Verheyen; Pieter Bex; Junwen He; Hakim Kobbi; Jeroen De Coster; Rafal Magdziak; et al. (OFC, 2023)