Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. - Yi-Shao Lai; Ping-Feng Yang; Chang-Lin Yeh (Microelectron. Reliab., 2006)

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. - Ping-Feng Yang; Hua-Chiang Wen; Sheng-Rui Jian; Yi-Shao Lai; Sean Wu; Rong-Sheng Chen (Microelectron. Reliab., 2008)

Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. - Bo-Ching He; Chun-Hu Cheng; Hua-Chiang Wen; Yi-Shao Lai; Ping-Feng Yang; Meng-Hung Lin; Wen-Fa Wu; Chang-Pin Chou (Microelectron. Reliab., 2010)

Evaluating nanotribological behavior of annealing Si0.8Ge0.2/Si films. - Ming-Jhang Wu; Hua-Chiang Wen; Shyh-Chi Wu; Ping-Feng Yang; Yi-Shao Lai; Wen-Kuang Hsu; Wen-Fa Wu; Chang-Pin Chou (Microelectron. Reliab., 2011)

A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. - Dao-Long Chen; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2012)

Nanotribological properties of ALD-processed bilayer TiO2/ZnO films. - Wun-Kai Wang; Hua-Chiang Wen; Chun-Hu Cheng; Ching-Hua Hung; Wu-Ching Chou; Wei-Hung Yau; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2014)

Thermal resistance of side by side multi-chip package: Thermal mode analysis. - Dao-Long Chen; Tei-Chen Chen; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2015)