Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. - Yan Qi; Rex Lam; Hamid R. Ghorbani; Polina Snugovsky; Jan K. Spelt (Microelectron. Reliab., 2006)

Impact of board and component metallizations on microstructure and reliability of lead-free solder joints. - A. R. Zbrzezny; Polina Snugovsky; D. D. Perovic (Microelectron. Reliab., 2007)