Sintered silver finite element modelling and reliability based design optimisation in power electronic module. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001 (Microelectron. Reliab., 2015)

A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001 (Microelectron. Reliab., 2015)

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001; Jose Angel Ortiz Gonzalez; Olayiwola Alatise (Microelectron. Reliab., 2017)

Evaluation of SiC Schottky Diodes Using Pressure Contacts. - Jose Angel Ortiz Gonzalez; Olayiwola Alatise; Attahir Murtala Aliyu; Pushparajah Rajaguru; Alberto Castellazzi; Li Ran; Philip Mawby; Chris Bailey 001 (IEEE Trans. Ind. Electron., 2017)

Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. - Pushparajah Rajaguru; H. Lu; Chris Bailey 001; Alberto Castellazzi; V. Pathirana; N. Udugampola; Florin Udrea (Microelectron. Reliab., 2018)

Predicting Damage and Life Expectancy of Subsea Power Cables in Offshore Renewable Energy Applications. - Fateme Dinmohammadi; David Flynn; Chris Bailey 001; Michael G. Pecht; Chunyan Yin; Pushparajah Rajaguru; Valentin Robu (IEEE Access, 2019)

Damage Mechanics-Based Failure Prediction of Wirebond in Power Electronic Module. - Pushparajah Rajaguru; Tim Tilford; Chris Bailey 001; Stoyan Stoyanov (IEEE Access, 2024)