Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application. - Zilian Qu; Wensong Wang; Xueli Li; Qi Li 071; Yuanjin Zheng (IEEE Trans. Instrum. Meas., 2021)

Task Scheduling and Privacy Protection for Multi-UAV Dynamic Environment. - Qi Li 071; Xiaohong Cheng; Yongkang Gong 001; Quan Zhou 008 (IEEE Internet Things J., 2025)